Method of forming multiple patterned layers on wafer and exposure apparatus thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11342184
APP PUB NO 20210159071A1
SERIAL NO

16694974

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Abstract

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An exposure apparatus for transferring a pattern of a reticle onto a wafer is provided. The exposure apparatus includes an illumination module, a reticle stage, a projection module, a wafer stage, and a control unit. The control unit is configured to calculate an alignment setting of the reticle. The wafer includes a first layer and a second layer disposed on the first layer. The first layer includes a first alignment parameter. The second layer includes a second alignment parameter. The control unit obtains a first weighting factor predetermined according to a property of the first layer, and a second weighting factor predetermined according to a property of the second layer. The alignment setting of the reticle is calculated according to the first alignment parameter, the first weighting factor, the second alignment parameter, and the second weighting factor.

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Patent Owner(s)

Patent OwnerAddress
XIA TAI XIN SEMICONDUCTOR (QING DAO) LTDSINO-GERMAN ECOPARK NO 172 TAIBAISHAN RD HUANGDAO DISTRICT QINGDAO CITY QINGDAO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeon, Bum-Hwan Singapore, SG 3 0
Kim, Soo-Hyoung Singapore, SG 4 5
Kwon, Byung-In Singapore, SG 9 1
Lee, Kihyung Singapore, SG 42 240
Yang, Siwon Singapore, SG 4 2

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