Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor
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United States of America Patent
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May 24, 2022
Grant Date -
Feb 11, 2021
app pub date -
Oct 23, 2020
filing date -
Nov 9, 2012
priority date (Note) -
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Abstract
There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as 1/2 of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as 1/2 of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≤(B+C)/A≤1.745.
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