Tiered locking mechanism for securing component cards to different height connectors for a main board
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United States of America Patent
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May 24, 2022
Grant Date -
Mar 3, 2022
app pub date -
Nov 30, 2020
filing date -
Sep 3, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A tiered locking mechanism secures a component card to a printed circuit board and includes a base, a top slider structure, and a biasing element. The base includes a first-tier side wall and a coupling structure configured to engage the PCB. The top slider structure includes a second-tier side wall along with protrusions having a beveled edge. The top slider structure is slidable between locked and unlocked positions. The unlocked position includes the protrusions being displaced away from a component card engagement side relative to the locked position. A bottom one of the protrusions and the first-tier side wall form a first receiving slot in the locked position. Atop one of the plurality of protrusions and the second-tier wall form a second receiving slot. The biasing element is configured to urge the top slider structure toward the locked position and to compress as the top slider structure moves away from the component card engagement side.
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