Circuit of communication interface between two dies and method to manage communication interface
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United States of America Patent
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May 17, 2022
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N/A
app pub date -
Feb 25, 2021
filing date -
Feb 25, 2021
priority date (Note) -
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Abstract
A circuit of communication interface between dies is provided. The circuit includes a first interface of the first die having a serializer to serialize an input data of N bits a serialized data for transmitting out and a second interface of the second die having a de-serializer to receive and deserialize the serialized data into a de-serialized data. In addition, an interconnection structure connected between the first die and the second die to connect the serializer and the de-serializer, wherein the interconnection structure is an interposer or a redistribution layer of a semiconductor structure to form a parallel bus for transmitting the serialized data in one line of the parallel bus between the first die and the second die. A clock generator provides a first clock to a first ripple counter of the serializer and a second clock to a second ripple counter of the de-serializer.
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