Multilayer filter including a capacitor connected with at least two vias
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United States of America Patent
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Nov 30, 2021
Grant Date -
Jun 25, 2020
app pub date -
Dec 19, 2019
filing date -
Dec 20, 2018
priority date (Note) -
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Abstract
A multilayer filter may include a plurality of dielectric layers stacked in a Z-direction. A first conductive layer may overlie one of the dielectric layers, and a second conductive layer may overlie another of the dielectric layers and be spaced apart from the first conductive layer in the Z-direction. A first via may be connected with the second conductive layer at a first location. A second via may be connected with the second conductive layer at a second location that is spaced apart in a first direction from the first location. The first conductive layer may overlap the second conductive layer at an overlapping area to form a capacitor. At least a portion of the overlapping area may be located between the first location and the second location in the first direction. The second conductive layer may be free of via connections that intersect the overlapping area.
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