Electronically-activated, self-molding and re-shapeable load-bearing support structure system and methods for molding thereof

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United States of America Patent

PATENT NO 11331405
APP PUB NO 20200101190A1
SERIAL NO

16579837

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Abstract

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An electronically-activated, self-molding and re-shapeable load-bearing support structure system is provided that includes a first composite structure. The first composite structure includes a first layer of a first thermally-responsive polymer; one or more first heating elements positioned adjacent to the first layer on a first heating element side; a second layer of the first thermally-responsive polymer positioned adjacent to the first heating elements on a second heating element side; a temperature sensor communicating with at least the first layer or the second layer of the first thermally-responsive polymer; one or more electrical connectors electrically communicating with the heating elements; and an electrical controller detachably connectable to at least one of the electrical connectors of the composite for providing an electrical current to the heating elements. A method of molding the load-bearing support structure system is also provided.

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Patent Owner(s)

Patent OwnerAddress
NANO AND ADVANCED MATERIALS INSTITUTE LIMITEDUNITS 515-517 5/F LAKESIDE 1 NO 8 SCIENCE PARK WEST AVENUE HONG KONG SCIENCE PARK SHATIN NEW TERRITORIES HONG KONG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Cheuk Yin Hong Kong, HK 4 4
Liu, Chenmin Hong Kong, HK 60 83
Lu, Shengbo Hong Kong, HK 36 42
Zhu, Yong Hong Kong, HK 161 748

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