Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin film

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United States of America

PATENT NO 11330721
APP PUB NO 20200253059A1
SERIAL NO

16854310

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Abstract

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A resin film includes a resin composition for forming a flexible resin layer. The resin composition includes an elastomer, a polymerizable compound, and a polymerization initiator. A laminated film includes a base material film, a resin film formed on the base material film, and a protective film attached to the resin film.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATIONTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Hidenori Tokyo, JP 27 427
Masuko, Takashi Tokyo, JP 76 640
Minegishi, Tomonori Tokyo, JP 17 107
Otake, Shunsuke Tokyo, JP 13 31
Shibata, Tomoaki Tokyo, JP 76 656
Yori, Hanako Tokyo, JP 8 66

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