Partially perforated assembly
Number of patents in Portfolio can not be more than 2000
United States of America
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May 10, 2022
Grant Date -
Oct 3, 2019
app pub date -
Oct 31, 2017
filing date -
Oct 31, 2017
priority date (Note) -
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Abstract
A partially perforated assembly includes a perforated film layer, a perforated adhesive layer applied to one side of said film layer, a non-perforated overlaminate film layer on the other side of said perforated film layer, and a release liner on the side of said perforated adhesive layer remote from said perforated film layer. When the release liner is removed and the remaining layers of the assembly are applied to a substrate, the remaining layers of the assembly comprise a void network. The void network fluidly interconnects at least two discrete perforation holes in the perforated film and adhesive layers with each other and/or the ambient environment around the assembly so as to facilitate air communication among the holes and/or between the holes and the ambient environment.
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