Antenna packaging structure and method for forming the same

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United States of America

PATENT NO 11316252
APP PUB NO 20210391637A1
SERIAL NO

17133382

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Abstract

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The present disclosure provides an antenna packaging structure and a method for forming the same. The structure includes: a supporting substrate, a rewiring layer on the supporting substrate, a first antenna layer disposed on the rewiring layer, first metal feedline pillars disposed on the first antenna layer, a first packaging layer covering the first metal feedline pillars except exposing the top surfaces of the first metal feedline pillars; a second antenna layer on the first packaging layer, second metal feedline pillars, a second packaging layer covering the second metal feedline pillars except exposing the top surfaces of the second metal feedline pillars; a third antenna layer disposed on the second packaging layer, semiconductor chips connected to the rewiring layer, a metal bump disposed inside an opening in the rewiring layer, and a third packaging layer encapsulating the semiconductor chips and the metal bump.

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Patent Owner(s)

Patent OwnerAddress
SJ SEMICONDUCTOR (JIANGYIN) CORPORATION9 DONGSHENG WEST ROAD JIANGYIN CITY JIANGSU PROVINCE 214437

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Yenheng JiangYin, CN 70 82
Lin, Chengchung JiangYin, CN 92 105
Wu, Chengtar JiangYin, CN 51 59
Xu, Han JiangYin, CN 94 1226
Xue, Yayuan JiangYin, CN 3 1

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