Radio frequency package
Number of patents in Portfolio can not be more than 2000
United States of America
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Apr 26, 2022
Grant Date -
Jan 13, 2022
app pub date -
Dec 2, 2020
filing date -
Dec 2, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A radio frequency package includes a first connection member having a first stack structure including at least one first insulating layer and at least one first wiring layer; a second connection member having a second stack structure including at least one second insulating layer and at least one second wiring layer; a core member including a core insulating layer and disposed between the first and second connection members; and a first chip antenna disposed to be surrounded by the core insulating layer. The first chip antenna includes a first dielectric layer disposed to be surrounded by the core insulating layer; a patch antenna pattern disposed on an upper surface of the first dielectric layer; and a feed via disposed to at least partially penetrate the first dielectric layer, providing a feed path of the patch antenna pattern and connected to the at least one first wiring layer.
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