Method for manufacturing substrate for flexible printed wiring board, and substrate for flexible printed wiring board
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Apr 19, 2022
Grant Date -
Mar 18, 2021
app pub date -
Sep 15, 2020
filing date -
Sep 15, 2020
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is a method for manufacturing a substrate for flexible printed wiring board, comprising a laminated body forming step and an integration step, wherein in the laminated body forming step, on an upper surface and a lower surface of a fluororesin layer having a modified surface, a first and second reinforcing resin layers having a coefficient of thermal expansion smaller than that of the fluororesin layer are respectively stacked through a first thermosetting adhesive, on the first reinforcing resin layer and/or the second reinforcing resin layer, a conductor layer is stacked through a second thermosetting adhesive, to form a laminated body, and in the integration step, the laminated body is heated and integrated at a temperature not lower than a curing temperature of the first and second thermosetting adhesives and lower than a melting point of the fluororesin layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully