Photosensitive module
Number of patents in Portfolio can not be more than 2000
United States of America
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Apr 19, 2022
Grant Date -
Oct 22, 2020
app pub date -
Apr 17, 2020
filing date -
Apr 17, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A photosensitive module is provided. The photosensitive module includes a base, an integrated package substrate, and a photosensitive element. The integrated package substrate is connected to the base. The integrated package substrate has a plurality of first electronic components, and the first electronic components are housed inside the integrated package substrate without being exposed to external environment. The photosensitive element is connected to the integrated package substrate, and the photosensitive element is configured to receive a light beam traveling along an optical axis.
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