Method of vertically vibrating a bonding arm
Number of patents in Portfolio can not be more than 2000
United States of America
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Apr 12, 2022
Grant Date -
Dec 10, 2020
app pub date -
Aug 26, 2020
filing date -
Aug 26, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.
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