Power electronic module
Number of patents in Portfolio can not be more than 2000
United States of America
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Apr 5, 2022
Grant Date -
Apr 16, 2020
app pub date -
Oct 10, 2019
filing date -
Oct 10, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A power electronic component including a surface adapted to be attached to a heatsink, the surface forming a bottom surface of the power electronic component, one or more power electronic semiconductor chips mounted on a substrate above the bottom surface, and a housing enclosing the one or more power electronic semiconductor chips. The power electronic component includes a thermal insulator disposed above the one or more power electronic semiconductor chips, such that the bottom surface and the thermal insulator are on the opposite sides of the one or more power electronic semiconductor chips.
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