Template that improves solder-paste stenciling and production method thereof
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United States of America
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Apr 5, 2022
Grant Date -
Dec 17, 2020
app pub date -
Mar 6, 2019
filing date -
Mar 6, 2019
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Abstract
A template or stencil with perforations, which improves solder-paste stencilling on an object, includes: a first area treated with precision powder on a bottom laminar face of the template, the treated face covering at least an area where perforations are distributed; a second area treated with precision powder on a top laminar surface of the template, the second treated area encircling the perforations; and a third area treated twice with precision powder on the bottom laminar surface, the third area encircling the perforations of the template. A method for producing a template that improves solder-paste stencilling on an object is also provided, as is and to a method for the improved application of solder-paste on an object, such as a printed circuit board.
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