Semiconductor package structure

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United States of America

PATENT NO 11296651
APP PUB NO 20210036658A1
SERIAL NO

17074618

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Abstract

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A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED SEMICONDUCTOR ENGINEERING INC26 CHIN 3RD ROAD NANZIH DIST KAOHSIUNG 811

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Cheng-Ling Kaohsiung, TW 8 10
Huang, Ching-Han Kaohsiung, TW 28 72
Lai, Kuo-Hua Kaohsiung, TW 11 80
Lai, Lu-Ming Kaohsiung, TW 68 134
Liu, Hui-Chung Kaohsiung, TW 11 10
Tseng, Chi Sheng Kaohsiung, TW 17 32

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