Die bonder incorporating rotatable adhesive dispenser head
Number of patents in Portfolio can not be more than 2000
United States of America
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Mar 29, 2022
Grant Date -
Jun 25, 2020
app pub date -
Dec 24, 2018
filing date -
Dec 24, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
An adhesive dispenser for a die bonding apparatus has an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate, and a head conveyer configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads. The head conveyor includes a first linear positioning motor operative to convey the adhesive dispenser head along the first axis and a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head. The rotary positioning motor is configured to cooperate with the first linear positioning motor to convey the adhesive dispenser head along the second axis to the target dispensing positions.
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