Deposition method and deposition apparatus
Number of patents in Portfolio can not be more than 2000
United States of America
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Mar 29, 2022
Grant Date -
Oct 15, 2020
app pub date -
Jun 24, 2020
filing date -
Jun 24, 2020
priority date (Note) -
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Abstract
A deposition method of arranging a discharge portion of a striker near a target to induce arc discharge and forming a film on a substrate using a plasma generated by the arc discharge is disclosed. The method includes a changing step of changing a position for inducing the arc discharge by the striker in a region set in the target, a deposition step of forming the film on the substrate using the plasma generated by inducing the arc discharge at the position, and a reduction step of reducing the region in accordance with use of the target.
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