Bulk ruthenium chemical mechanical polishing composition

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11279850
APP PUB NO 20190300750A1
SERIAL NO

16299935

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Abstract

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The compositions of the present disclosure polish surfaces or substrates that at least partially include ruthenium. The composition includes a synergistic combination of ammonia and oxygenated halogen compound. The composition may further include abrasive and acid(s). A polishing composition for use on ruthenium materials may include ammonia, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition; hydrogen periodate, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition; silica, present in an amount of 0.01 wt % to 12 wt %, based on the total weight of the composition; and organic sulfonic add, present in an amount of 0.01 wt % to 10 wt %, based on the total weight of the composition, wherein the pH of the composition is between 6 and 8.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM ELECTRONIC MATERIALS U S A INC80 CIRCUIT DRIVE NORTH KINGSTOWN RI 02852

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hu, Bin Chandler, US 275 1156
Huang, Ting-Kai Taiwan, CN 25 56
Liang, Yannan Gilbert, US 23 6
Lin, David (Tawei) Chandler, US 4 6
Wen, Liqing (Richard) Mesa, US 4 6

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