Liquid metal infiltration rework of electronic assembly
Number of patents in Portfolio can not be more than 2000
United States of America
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Mar 22, 2022
Grant Date -
Apr 22, 2021
app pub date -
Oct 22, 2019
filing date -
Oct 22, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a method for removing an electronic socket from a printed wiring board. The method comprises placing an embrittlement sheet over an electronic socket on a printed wiring board. The electronic socket is mounted to the printed wiring board using a plurality of hidden solder joints. The method further comprises causing the embrittlement sheet to melt. The melted embrittlement sheet wets the plurality of hidden solder joints. The electronic socket is removed from the printed wiring board by breaking the embrittled solder joints.
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