Semiconductor device package having a core substrate and an embedded component in the core substrate
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United States of America
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Mar 15, 2022
Grant Date -
May 27, 2021
app pub date -
Nov 27, 2019
filing date -
Nov 27, 2019
priority date (Note) -
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Abstract
A semiconductor device package includes an electronic component, a first passivation layer having an inner surface surrounding the electronic component, and a conductive layer disposed on the inner surface of the first passivation layer. The electronic component has a first surface, a second surface opposite the first surface, and a lateral surface extended between the first surface and the second surface. The conductive layer has a relatively rough surface. A method of manufacturing a semiconductor device package is also disclosed.
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