Dual micro-electro mechanical system and manufacturing method thereof

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United States of America

PATENT NO 11274037
APP PUB NO 20210130167A1
SERIAL NO

16937710

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Abstract

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A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Yang-Che Hsinchu, TW 39 114
Liang, Victor Chiang Hsinchu, TW 108 292
Lin, Chen-Hua Douliu, TW 54 292
Liu, Chwen-Ming Hsinchu, TW 39 374
Teng, Yi-Chuan Zhubei, TW 54 510
Tseng, Huang-Wen Zhubei, TW 33 116

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