Substrate and method for fabricating flexible electronic device and rigid substrate

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11272621
APP PUB NO 20190191567A1
SERIAL NO

16283503

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Abstract

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A method for fabricating a flexible electronic device, including the steps of: providing channels on a rigid substrate; adhering a flexible substrate to the rigid substrate with an adhesive; fabricating an electronic device on the flexible substrate; injecting a chemical substance into the channels; and reacting the chemical substance with the adhesive and peeling the flexible substrate from the rigid substrate. The rigid substrate comprises a first surface, a second surface opposite the first surface, and a side wall extending between the first surface and the second surface. The channels are provided on the first surface of the rigid substrate. The channels are in communication with an injection port, the injection port is located on the side wall of the rigid substrate, and a portion of the side wall is located between the injection port and the first surface.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN ROYOLE TECHNOLOGIES CO LTDA4-1501 KEXING SCIENCE PARK NO 15 KEYUAN RD SCIENCE AND TECHNOLOGY PARK NANSHAN DISTRICT SHENZHEN GUANGDONG 518052

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Zihong Guangdong, CN 57 309
Wei, Peng Guangdong, CN 65 163
Yu, Xiaojun Guangdong, CN 74 1789

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