Headphone earcup mount in continuous headband-spring headphone system

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11272287
APP PUB NO 20210044900A1
SERIAL NO

17076903

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Various implementations include headphone systems. In one implementation, a headband for a headphone system, includes: a continuous spring section sized to extend over a head of a user; an earcup mount coupled with an end of the continuous spring section, the continuous spring section and the earcup mount forming an arcuate joint, and the earcup mount configured to rotate relative to the continuous spring section at the arcuate joint; and a friction assembly spanning between the continuous spring section and the earcup mount, the friction assembly linearly arranged across the arcuate joint and configured to provide a substantially constant resistance to the rotation of the earcup mount relative to the continuous spring section, where the friction assembly includes a coupler having a primary axis extending across the arcuate joint, where the earcup mount rotates off-axis relative to the primary axis of the coupler.

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Patent Owner(s)

  • BOSE CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Curtiss, Eric Douglas East Boston, US 8 13
Daley, Bennett P Waltham, US 30 277
Graff, Allen Timothy Sutton, US 6 30
Grebe, Richard Arthur Stow, US 10 90

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