Rigid-flex printed circuit board and method for manufacturing the same
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United States of America
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Mar 1, 2022
Grant Date -
Jan 27, 2022
app pub date -
Sep 23, 2020
filing date -
Sep 23, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A rigid-flex printed circuit board includes an inner circuit substrate, two adhesive sheet layers formed on the inner circuit substrate, two shielding structures, and two outer circuit layers. The inner circuit substrate is divided into a flexible area, a first and second rigid area. Each shielding structure includes a copper layer, a metal seed layer formed on the copper layer, a flexible dielectric layer formed on the metal seed layer, and a backing adhesive sheet layer formed on the flexible medium layer. The backing adhesive sheet layer is pressed on the adhesive sheet layer and the inner circuit substrate located in the flexible area. Each outer circuit layer is formed on the copper layer, located in the first rigid area and the second rigid area and electrically connected to the inner circuit substrate.
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