Modular connector with printed circuit board wafer to reduce crosstalk
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United States of America
Stats
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Mar 1, 2022
Grant Date -
Sep 30, 2021
app pub date -
Mar 26, 2020
filing date -
Mar 26, 2020
priority date (Note) -
In Force
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Abstract
A circuit board for use in a modular electrical connector. The circuit board has a first surface and an oppositely facing second surface. Signal pathways are provided on the first surface. The signal pathways have signal pathway ends abutting a mounting end of the circuit board. First ground pathways are provided on the first surface. The first ground pathways are positioned adjacent at least one of the signal pathways. The first ground pathways have first ground pathway ends abutting the mounting end of the circuit board. One or more second ground pathways are provided on the second surface. The one or more second ground pathways have second ground pathway ends abutting the mounting end of the circuit board. The positioning of the signal pathway ends, the first ground pathway ends and the second ground pathway ends abutting the mounting end reduces crosstalk between signal pairs.

First Claim
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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TE CONNECTIVITY SOLUTIONS GMBH | MÜHLENSTRASSE 26 SCHAFFHAUSEN 8200 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Martin, Andrew M | Glendale, US | 3 | 21 |
Miller, Keith Edwin | Manheim, US | 57 | 402 |
Springston,, II Eric Douglas | Hershey, US | 6 | 126 |
Tsang, Albert | Harrisburg, US | 27 | 600 |
Walton, Scott Eric | Mount Joy, US | 18 | 21 |
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