Integrated circuit
Number of patents in Portfolio can not be more than 2000
United States of America
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Mar 1, 2022
Grant Date -
Apr 23, 2020
app pub date -
Dec 20, 2019
filing date -
Dec 20, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A device includes a dielectric layer, an interlayer metal pad in the dielectric layer, a first capacitor over the interlayer metal pad, and a second capacitor over the dielectric layer. The first capacitor includes a first bottom capacitor electrode over and in contact with the interlayer metal pad, a first top capacitor electrode, and a first inter-electrode dielectric layer between the first bottom capacitor electrode and the first top capacitor electrode. The second capacitor includes a second bottom capacitor electrode over and in contact with the dielectric layer, a second top capacitor electrode, and a second inter-electrode dielectric layer between the second bottom capacitor electrode and the second top capacitor electrode.
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