Socket with thermal conductor
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United States of America Patent
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Feb 22, 2022
Grant Date -
Feb 7, 2019
app pub date -
Feb 21, 2018
filing date -
Feb 21, 2018
priority date (Note) -
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Abstract
Embodiments herein may include apparatuses, systems, and processes related to a socket with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB), which may be a mother board, where the socket has a cavity into which a thermal conductor is inserted to conduct heat from the package substrate to the PCB. In embodiments, the PCB may contain thermal vias to conduct heat from one side of the PCB to the other side. Other embodiments may be described and/or claimed.
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