Methods for producing an etch resist pattern on a metallic surface
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United States of America
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N/A
Issued Date -
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app pub date -
Sep 24, 2020
filing date -
Sep 24, 2020
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.
First Claim
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International Classification(s)
- B41M:PRINTING, DUPLICATING, MARKING, OR COPYING PROCESS....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- 2020 Application Filing Year
- B41M Class
- 558 Applications Filed
- 298 Patents Issued To-Date
- 53.41 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- B41M Class
- 84.32 % this patent is cited more than
- 3 Age
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