Soldering apparatus and method of fixing gasket to the soldering apparatus

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United States of America

PATENT NO 11235407
APP PUB NO 20200269337A1
SERIAL NO

16788738

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Importance

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Abstract

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Provided are a soldering apparatus that allows a gasket to be easily attached to and detached from the soldering apparatus, and a method of fixing the gasket to the soldering apparatus. The soldering apparatus includes: a furnace body; a gasket that is provided to at least a part of the furnace body, and that seals the furnace body; and a push rivet that fixes the gasket in an attachable/detachable manner to the furnace body.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTDTOKYO JAPAN TOKYO METROPOLIS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hiyama, Tsutomu Tokyo, JP 18 69

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