Personalized copper block for selective solder removal

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11235404
SERIAL NO

16826226

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Importance

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Abstract

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Disclosed are embodiments of forming porous copper on the end of a copper pillar. The embodiments may be used to remove solder from selected locations on a chip or laminate substrate.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arvin, Charles L Poughkeepsie, US 153 801
Brunschwiler, Thomas Thalwil, CH 45 290
Del, Carro Luca Adliswil, CH 4 9
Muzzy, Chris Burlington, US 8 8
Weiss, Thomas Poughkeepsie, US 228 5866

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