Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11233125
APP PUB NO 20200279921A1
SERIAL NO

16650515

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Abstract

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A silicon carbide substrate includes a first impurity region having a first conductivity type, a second impurity region having a second conductivity type, a third impurity region having the first conductivity type, and a fourth impurity region provided between a second main surface and a bottom surface and having the second conductivity type. The first impurity region has a first region being in contact with the second impurity region and having a first impurity concentration, a second region being continuous to the first region, provided between the first region and the second main surface, and having a second impurity concentration lower than the first impurity concentration, and a third region being continuous to the first region and having a third impurity concentration higher than the first impurity concentration. A side surface is in contact with the third region, the second impurity region, and the third impurity region.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shiomi, Hiromu Osaka, JP 68 1104

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