Semiconductor device package and method of manufacturing the same
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United States of America
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Jan 25, 2022
Grant Date -
Nov 5, 2020
app pub date -
May 2, 2019
filing date -
May 2, 2019
priority date (Note) -
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Abstract
A semiconductor device package includes a dielectric layer, a package body and a protection structure. The dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The package body is disposed on the first surface of the dielectric layer. The package body covers a first portion of the lateral surface of the dielectric layer and exposes a second portion of the lateral surface of the dielectric layer. The protection structure is disposed on the second portion of the lateral surface of the dielectric layer.
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