Bonded article of thin glass on support substrate, preparation method and use thereof
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United States of America
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Jan 18, 2022
Grant Date -
Apr 28, 2016
app pub date -
Dec 21, 2015
filing date -
Dec 21, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A method for making a bonded article, wherein a thin glass substrate is bonded on a support substrate in the absence of any interlayer by an electrostatic adhesion process with the assistance of external pressure, the pressure is applied constantly or stepwise during the adhesion process by use of a tool such as a roll or a wheel or other movable device with curved surface. The bonded article has no defects, e.g. bubbles or inclusions, in the bonded interface, which benefits transportation of the thin glass substrate and its post-processing as well. Such defect-free bonded article is also disclosed. Pressure supported electrostatic adhesion, initiated by electrostatic charges adhesion of a two members, e.g. a substrate member and a support member, is enabled to minimize, prevent and exclude defects, distortion between the adhered surfaces.
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