Device for the separate application of solder material deposits
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United States of America
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Jan 18, 2022
Grant Date -
Dec 8, 2016
app pub date -
Oct 23, 2014
filing date -
Oct 23, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a device (10) for the separate application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for separately conveying the solder material deposits from a solder material reservoir (12) toward an application device (33), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P2, in which the solder material deposit is exposed to a pressure gas, and from which the solder material deposit is transferred to an application opening of an application nozzle (36) of the application device into an application position P3, wherein a detector device (69) is provided that serves to trigger a treatment of the solder material deposit arranged in the application position P3 with laser radiation emitted by a laser device, wherein the detector device has a reflection sensor (70) that detects reflection radiation (72) that is reflected by the solder material deposit arranged in the application position P3.
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