Double-sided chip stack assembly

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11211373
SERIAL NO

17181018

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Abstract

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A chip stack assembly uses a monolithic metallic multilevel connector to both join connections on at different heights on the top sides at the of the chips, and to provide a large, robust connection surface on top of top of the assembly.

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Patent Owner(s)

Patent OwnerAddress
UNITED SILICON CARBIDE INC7 DEER PARK DRIVE SUITE E MONMOUTH JUNCTION NJ 08852

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhalla, Anup Princeton Junction, US 325 5864
Sudario, Francisco Astrera Santa Rosa, PH 1 0

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