Hybrid heat pump system
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
Dec 28, 2021
Grant Date -
Dec 17, 2020
app pub date -
Jun 13, 2019
filing date -
Jun 13, 2019
priority date (Note) -
In Force
status (Latency Note)
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Importance

US Family Size
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Abstract
A hybrid heat pump system including first compression means operable to form a refrigerant vapor and increases the pressure of the refrigerant vapor; condensing means to receive pressurized vapor and condense the vapor to a liquid; pressure reduction means through which the liquid refrigerant passes to reduce the pressure of the liquid to form a mixture of liquid and vapor refrigerant; evaporator means to receive the mixture of liquid and vapor refrigerant to evaporate the remaining liquid; second compression means including first and second inlet ports and an outlet port to receive a portion of the refrigerant vapor from the evaporator means and the pressurized vapor from the first compression means; increase the pressure thereof; and pass the pressurized vapor to the condensing means through the outlet port; and a conduit to pass a portion of the refrigerant vapor leaving the first compression means to the second compression means.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
CITY UNIVERSITY OF HONG KONG | TAT CHEE AVENUE KOWLOON HONG KONG |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Wu, Wei | Kowloon, HK | 1105 | 10307 |
# of filed Patents : 1105 Total Citations : 10307 |
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3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jun 28, 2025 |
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