Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
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United States of America Patent
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Nov 30, 2021
Grant Date -
Sep 26, 2013
app pub date -
Mar 21, 2012
filing date -
Mar 21, 2012
priority date (Note) -
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Abstract
A circuit package is provided, the circuit package including: an electronic circuit; a metal block next to the electronic circuit; encapsulation material between the electronic circuit and the metal block; a first metal layer structure electrically contacted to at least one first contact on a first side of the electronic circuit; a second metal layer structure electrically contacted to at least one second contact on a second side of the electronic circuit, wherein the second side is opposite to the first side; wherein the metal block is electrically contacted to the first metal layer structure and to the second metal layer structure by means of an electrically conductive medium; and wherein the electrically conductive medium includes a material different from the material of the first and second metal layer structures or has a material structure different from the material of the first and second metal layer structures.
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