Induction curing of cell-based structural arrays

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United States of America Patent

PATENT NO 11186046
APP PUB NO 20190001581A1
SERIAL NO

15636819

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Abstract

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Adhesive bondlines in a cell-based structural array are thermally cured using tooling blocks inserted into the cells. The tooling blocks have embedded susceptors that are inductively heated by an alternating electromagnetic field generated by an electromagnet.

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Patent Owner(s)

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THE BOEING COMPANY100 NORTH RIVERSIDE PLAZA MAIL CODE 2T-42 CHICAGO IL 60606-1596

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Banks, David L Renton, US 21 468
Georgeson, Gary Earnest Tacoma, US 2 2
Hafenrichter, Joseph Lawrence Auburn, US 19 81
Marshall, Joseph A Kent, US 17 273
Miller, Robert James Fall City, US 46 326
Mori, Paul B Seattle, US 2 2

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