Solder printing inspection device, solder printing inspection method and method of manufacturing substrate
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United States of America Patent
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Nov 23, 2021
Grant Date -
Nov 21, 2019
app pub date -
Jul 31, 2019
filing date -
Feb 9, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.
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