Etching for bonding polymer material to a metal surface
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United States of America Patent
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Nov 16, 2021
Grant Date -
Mar 28, 2019
app pub date -
Sep 7, 2018
filing date -
Sep 8, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.
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International Classification(s)
- H04M:TELEPHONIC COMMUNICATION
- C25D:PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC ....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- C23G:CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CH....
- B29K:INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, ....
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- C25F:PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIAL....
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