Flexible printed circuit EMI enclosure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11178768
APP PUB NO 20170290154A1
SERIAL NO

15089303

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Abstract

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Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height.

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Patent Owner(s)

  • INTEL CORP.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chuah, Tin Poay Bayan Lepas, MY 54 59
Goh, Eng Huat Penang, MY 108 300
Hall, Stephen H Forest Grove, US 37 163
Koh, Boon Ping Seberang Jaya, MY 36 82
Yong, Khang Choong Puchong, MY 60 139

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