Surface treatment device comprising a paddle for stirring a surface treatment solution, paddle for stirring a surface treatment solution and method thereof
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United States of America Patent
Stats
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Nov 16, 2021
Grant Date -
Oct 10, 2019
app pub date -
Mar 28, 2019
filing date -
Apr 10, 2018
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The purpose of the present invention is to provide a surface treatment device and a paddle with improved strength and uniform plating thickness by uniformly stirring surface treatment solution near an object to be plated. Also, the purpose of the present invention is to provide a surface treatment method capable of stirring for a long period of time, by uniformizing plating thickness, and by improving a strength of a paddle. A surface treatment device comprising at least one plateshaped paddle, in a surface treatment tank, for stirring surface treatment solution near an object to be plated by reciprocally moving the paddle with respect to the object to be plated, wherein the paddle is configured by integrally forming a plurality of square bars provided in depth direction of the surface treatment solution in the surface treatment tank along the object to be plated at regular intervals, and a square bar of the plurality of square bars is provided with a curved surface with respect to the object to be plated in a cross section in thickness direction of the square bar.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
C UYEMURA & CO LTD | OSAKA-SHI OSAKA 541-0045 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hashimoto, Daisuke | Osaka, JP | 216 | 2475 |
# of filed Patents : 216 Total Citations : 2475 | |||
Kiso, Masayuki | Osaka, JP | 18 | 589 |
# of filed Patents : 18 Total Citations : 589 | |||
Matsuyama, Daisuke | Osaka, JP | 23 | 47 |
# of filed Patents : 23 Total Citations : 47 | |||
Okada, Akira | Osaka, JP | 173 | 2504 |
# of filed Patents : 173 Total Citations : 2504 | |||
Okuda, Tomoji | Osaka, JP | 15 | 12 |
# of filed Patents : 15 Total Citations : 12 | |||
Taniguchi, Keita | Osaka, JP | 16 | 24 |
# of filed Patents : 16 Total Citations : 24 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | May 16, 2025 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 16, 2029 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 16, 2033 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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Feb 12, 2021 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BINDER, YEHUDA;REEL/FRAME:055251/0719 Owner name: MAY PATENTS LTD., ISRAEL Effective Date: Feb 12, 2021 |

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