Wafer-level methods for manufacturing uniform layers of material on optoelectronic modules
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United States of America Patent
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Nov 9, 2021
Grant Date -
Jun 4, 2020
app pub date -
Jul 24, 2018
filing date -
Jul 25, 2017
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Abstract
Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.
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