Jet solder bath and jet soldering apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11167364
APP PUB NO 20190039159A1
SERIAL NO

16051755

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTD23 SENJU-HASHIDO-CHO ADACHI-KU TOKYO 120-8555

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawashima, Yasuji Osaka, JP 9 71
Komine, Shigeo Tokyo, JP 25 308
Okuno, Tetuya Saitama, JP 1 3
Sugihara, Takashi Tochigi, JP 64 520
Suzuki, Ryoichi Tokyo, JP 169 1258

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