Method and device for plating a recess in a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 2, 2021
Grant Date -
Jul 25, 2019
app pub date -
Jan 24, 2019
filing date -
Jan 25, 2018
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps:
- a) Providing a substrate with a substrate surface comprising at least one recess,b) applying a replacement gas to the recess to replace an amount of ambient gas in the recess to at least partially clear the recess from the ambient gas,c) applying a processing fluid to the recess, wherein the replacement gas dissolves in the processing fluid to at least partially clear the recess from the replacement gas, andd) plating the recess.
First Claim
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International Classification(s)
- 2019 Application Filing Year
- C25D Class
- 601 Applications Filed
- 372 Patents Issued To-Date
- 61.90 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- C25D Class
- 72.87 % this patent is cited more than
- 4 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | May 2, 2025 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 2, 2029 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 2, 2033 |
