Semiconductor devices
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United States of America Patent
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Oct 26, 2021
Grant Date -
Apr 23, 2020
app pub date -
Jun 10, 2019
filing date -
Oct 19, 2018
priority date (Note) -
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Abstract
A semiconductor device may include a conductive structure on a substrate, a contact plug on the conductive structure, and a magnetic tunnel junction structure on the contact plug. A lower surface of the contact plug may have an area greater than that of an upper surface thereof, and the contact plug may include a capping pattern at least partially covering an upper surface of the conductive structure, a conductive pattern on the capping pattern, and an amorphous metal pattern on the conductive pattern.
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