Method and device for encapsulating components
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United States of America Patent
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Oct 19, 2021
Grant Date -
May 23, 2019
app pub date -
Jun 14, 2017
filing date -
Jun 14, 2016
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Abstract
A method and a device for hermetically encapsulating components using at least one gas discharge lamp, an inorganic material that is transparent for light and a light-absorbing inorganic medium, are provided. With a suitable selection, inorganic materials or inorganic media guarantee a very low level of permeability for oxygen, water vapor and reactive gases in contrast to organic materials or organic media. The encapsulation occurs in a time period of less than one second. In addition, the average temperature of the component only increases slightly, such that even components with temperature-sensitive regions can be encapsulated.
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