Integrated circuit heat dissipation using nanostructures
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United States of America Patent
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Oct 19, 2021
Grant Date -
N/A
app pub date -
Sep 30, 2019
filing date -
Feb 25, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.
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International Classification(s)
- 2019 Application Filing Year
- H01L Class
- 31892 Applications Filed
- 24691 Patents Issued To-Date
- 77.43 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 4 Age
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