Heating and cooling apparatus having moisture removal function for testing electrical characteristic of semiconductor element using probe system
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United States of America Patent
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Oct 19, 2021
Grant Date -
Aug 20, 2020
app pub date -
Feb 15, 2019
filing date -
Feb 15, 2019
priority date (Note) -
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Abstract
The present disclosure relates to a heating and cooling apparatus having a moisture removal function for testing electrical characteristics of a semiconductor element using a probe system, in which the heating and cooling apparatus is configured to be capable of hot and cold measurement of a wafer or a flat panel display product and to be capable of efficiently removing water droplets generated at the time of cooling by adding a vortex tube to a thermo-stream provided in a probe head of the probe system and configuring the vortex tube to be interlocked with a moisture removal device.
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